Through Hole Assembly

Plated through hole and mixed technology assembly represents a key service offering within our range of contract electronic manufacturing services.  This capability can be utilised at all levels from the initial production of very low volume, rapid prototype products, through to the ongoing manufacture of complex, multi-technology circuit board assemblies.  We are capable of producing both leaded and lead free (RoHS compliant) assemblies utilising both wave soldering and hand assembly techniques.

For single sided or wave soldering of chip components, Triode have an Seho Flow Solder machine for leaded assemblies and an Ersa Wave for RoHS compliant assemblies (SAC305).  We use no-clean fluxes to avoid costly post wave cleaning processes.

Not only do we have full capability for assembling all types of Through-Hole PCB assemblies but we can also offer a number of peripheral services such as conformal coating and potting.  In addition, we can also undertake device programming and the configuration of PCB assemblies prior to system integration or despatch.